Balanagar, Hyderabad,
Telangana 500011
Jeedimetla, Hyderabad,
Telangana 500014
Africa, Uganda
Description: Divides a continuous sheet of dough into individual biscuit portions using a specialized wafer mechanism for clean cuts.
Key Features: Adjustable cutting dies, synchronized with conveyor, durable blades.
Benefits: Consistent shape and size, high output, and reduced dough sticking.
Description: Custom-shaped cutting attachments for use with wafer cutting machines to create various biscuit and snack shapes.
Key Features: Made from food-grade materials, designed to customer specification.
Benefits: Enables product variety and brand-specific shapes.
Description: A machine that uses wafer to cleanly cut through sticky or layered doughs and confections without deformation.
Key Features: Wafer injection system, interchangeable dies.
Benefits: Clean cuts for intricate shapes, perfect for jelly-filled or layered biscuits.
Description: A high-efficiency mixer for blending dry and semi-dry ingredients like flour, spices, and starches.
Key Features: Spiral agitator, SS 304 construction, gentle yet thorough mixing action.
Benefits: Homogeneous mixing in less time, easy to load and unload.